SINGAPORE, Jan. 20, 2026 — ASMPT SMT Solutions has introduced the SIPLACE V, a new surface-mount technology (SMT) placement platform for electronics manufacturing, saying the system can deliver up to a 30% performance increase under production conditions.
The company said the platform was redesigned with a new machine frame, updated linear drives, and higher-resolution measurement systems intended to improve acceleration and placement precision. ASMPT said the machine is aimed at sectors including automotive electronics, consumer devices, smartphones, and IT and networking equipment.
ASMPT said initial field testing indicated the throughput improvement was maintained in high-mix settings with frequent product changeovers and higher process complexity. Martin Zistler, vice president of global engineering at Zollner Elektronik AG, said testing covered about 25,000 assembled modules and 7.3 million placed components.
ASMPT also introduced updated placement head options as part of the SIPLACE V platform. The company said the SIPLACE CP20 collect-and-place head is rated at up to 52,500 components per hour with 25 microns placement precision at three sigma.
The CPP head can switch between collect-and-place, pick-and-place, and mixed modes via software commands, ASMPT said, and is rated at up to 28,000 components per hour with placement forces up to 15 newtons.
For larger components, ASMPT said the SIPLACE TWIN VHF head can handle parts up to 200 × 150 × 28 millimeters and placement forces up to 100 newtons, with a throughput of up to 6,000 components per hour. The company said the head is intended for applications including advanced packages such as BGAs used in higher-performance computing and AI-related systems.
ASMPT said the SIPLACE V will be offered in single-gantry and dual-gantry configurations, with single-track or dual-track conveyor options. The company said a universal head interface is designed to allow head changes while the machine remains in operation.
The company said the platform supports boards up to 400 × 280 millimeters in dual-conveyor mode and up to 700 × 530 millimeters in single-conveyor mode. ASMPT said up to two tray units can be added to each machine, and that the design increases feeder slot capacity regardless of optional support features.
ASMPT said the SIPLACE V includes functions such as component inspection and traceability, as well as closed-loop sensor technology that measures component heights and PCB profiles in real time and adjusts placement forces automatically.
The company said the platform is designed to be compatible with existing ASMPT hardware such as feeders and cameras, and to work with its software portfolio, including the WORKS Software Suite and Factory Solutions.
Thomas Bliem, vice president of R&D at ASMPT SMT Solutions, said the platform is intended to support gradual line upgrades while maintaining compatibility with installed systems, and to provide a foundation for further automation and AI-based applications.
