SK hynix Targets HBM4E Leadership, Plans Sampling in 2026 and Mass Production by 2027
SK hynix Targets HBM4E Leadership, Plans Sampling in 2026 and Mass Production by 2027
  • Jung Yeon-jin
  • Published 2026.04.23 15:03
  • Comments 0
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SK hynix next-generation HBM4 memory chips for AI applications / Photo courtesy of SK hynix

SK hynix is accelerating efforts to secure leadership in next-generation high-bandwidth memory (HBM) technology, a critical component driving performance in AI semiconductors.

During its first-quarter 2026 earnings conference call on March 23, the company said it is preparing to deliver HBM4E samples to customers within the year. It added that, through close collaboration with clients, it aims to meet performance requirements and begin full-scale mass production and supply of HBM4E by 2027.

HBM4E represents a next-generation memory solution expected to significantly improve bandwidth and power efficiency compared to current HBM3E products. As global tech companies ramp up investment in AI infrastructure, competition in advanced HBM technologies is emerging as a key determinant of long-term competitiveness among memory manufacturers.

SK hynix highlighted its sixth-generation 10-nanometer-class (1c) process as a core technological advantage. The company said it is developing HBM4E based on this advanced node to meet increasingly demanding customer requirements. It noted that the process has already reached a mature stage in terms of yield and mass production capability, positioning the company to deliver stable, high-performance products aligned with customer expectations.

The announcement comes amid intensifying competition in the HBM market. Samsung Electronics and Micron Technology are also advancing their next-generation HBM development, making technological readiness and production timing critical factors in determining market share. SK hynix aims to maintain its competitive edge by leveraging the customer base it established with HBM3E.

The company also emphasized its long-term strategy of strengthening internal technological capabilities. SK hynix said it will continue focusing on the in-house development of core technologies to respond effectively to global memory demand over the long term, while maintaining technology leadership through superior product quality.

Market analysts view the latest update as confirmation that SK hynix is not only benefiting from short-term earnings growth but is also proactively positioning itself for the next phase of the AI memory market. By outlining a clearer roadmap for HBM4E development and mass production, the company is increasingly seen as transitioning from a traditional cyclical memory supplier to a key enabler of global AI infrastructure.


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