SK hynix Showcases HBM4 and AI Memory Innovations at NVIDIA GTC 2026, Expands Global AI Partnerships
SK hynix Showcases HBM4 and AI Memory Innovations at NVIDIA GTC 2026, Expands Global AI Partnerships
  • Jung So-yeon
  • Published 2026.03.17 11:11
  • Comments 0
이 기사를 공유합니다

Overview of SK hynix Exhibition Booth at NVIDIA GTC 2026. / Courtesy of SK hynix

SK hynix announced on March 17 that it will participate in NVIDIA’s GTC (GPU Technology Conference) 2026, taking place from March 16 to 19 in San Jose, California.

NVIDIA GTC is a leading global AI conference where major companies and developers gather to share the latest technologies and trends in artificial intelligence and accelerated computing.

At this year’s event, SK hynix will present its advanced memory technologies under the theme “Spotlight on AI Memory,” highlighting its role as a key infrastructure provider in the AI era. The company emphasized that its memory solutions help minimize data bottlenecks and maximize performance in AI training and inference, and are already integrated into NVIDIA’s AI infrastructure.

The exhibition booth will consist of three zones: the NVIDIA Collaboration Zone, Product Portfolio Zone, and Event Zone, all designed to provide an interactive and immersive experience for visitors.

In the NVIDIA Collaboration Zone, SK hynix will showcase joint achievements with NVIDIA, including real-world applications of HBM4, HBM3E, and SOCAMM2 in GPU-based AI accelerators. The company will also display a liquid-cooled eSSD developed in collaboration with NVIDIA, along with the DGX Spark AI supercomputer equipped with SK hynix’s LPDDR5X.

The Product Portfolio Zone will feature a comprehensive lineup of AI-focused memory products, including HBM4, HBM3E, high-capacity server DRAM modules, LPDDR6, GDDR7, eSSD, and automotive memory solutions. Visitors can explore product features and use cases through an interactive joystick-based interface.

In the Event Zone, attendees can participate in a hands-on “HBM 16-layer stacking game,” designed to help them better understand TSV processes and advanced stacking technologies used in high-performance AI semiconductors.

During the event, SK hynix plans to explore new collaboration opportunities aligned with the evolving AI industry landscape. Chairman Chey Tae-won and CEO Kwak Noh-jung, along with other executives, are expected to meet with global tech leaders to discuss AI advancements, infrastructure evolution, and long-term partnerships.

The company will also host technical sessions covering the future of AI-driven manufacturing and the critical role of memory technologies in enabling high-performance AI systems.

“Memory is no longer just a component but a key element that determines the structure and performance of AI infrastructure,” SK hynix said. “We will continue to lead the future of AI together with global partners by leveraging our comprehensive memory capabilities across data centers and on-device environments.”


댓글삭제
삭제한 댓글은 다시 복구할 수 없습니다.
그래도 삭제하시겠습니까?
Comments 0
댓글쓰기
계정을 선택하시면 로그인·계정인증을 통해
댓글을 남기실 수 있습니다.

Independent journalism on technology, industry and the forces reshaping Korea and the world.
  • Korea IT Times Co., Ltd. | 34 Gukjegeumyung-ro 8-gil, Yeongdeungpo-gu, Seoul, Republic of Korea
  • Business Registration No. 206-86-32195
  • Tel. +82-2-578-0434 | 010-2442-9446 | info@koreaittimes.com
  • Publisher & Editor-in-Chief: Younsoo Chung | Youth Protection Manager: Choul-woong Yeon
  • ©2004–2026 Korea IT Times. All rights reserved.
ND소프트