HYERES, France — Wise Integration plans to present its latest digital power conversion technologies at PCIM 2026 in Nuremberg, Germany, where the company will outline its roadmap for integrating digital control functions more directly into gallium nitride (GaN)-based power systems.
The company will showcase a range of AC-DC power conversion platforms powered by its WiseWare® digital control technology, covering applications from 240W to 7kW. The demonstrations reflect a broader industry trend toward higher power density and efficiency as artificial intelligence infrastructure, electric mobility, edge computing and other high-performance systems increase power requirements while operating within limited physical space.
Power electronics suppliers have increasingly adopted wide-bandgap semiconductor materials such as GaN and silicon carbide (SiC) to improve switching performance and energy efficiency. However, industry engineers note that gains at the semiconductor level do not automatically translate into equivalent improvements at the system level, particularly when conventional analog control architectures are used.
Wise Integration argues that digital control can address some of these limitations by enabling more precise timing control, higher switching frequencies, and improved management of efficiency, thermal behavior, and passive component sizing. The company is positioning its software-defined control approach as a means of simplifying the deployment of advanced power architectures across a broader range of applications.
At PCIM 2026, the company will demonstrate several converter configurations, including totem-pole power factor correction (PFC), LLC resonant converters, single-stage converters, and interleaved architectures. The demonstrations are intended to illustrate how digital control strategies can be applied across different power ranges and system topologies.
A key focus of the exhibition will be the company's WI73xxx platform, which represents the next phase of its effort to integrate digital intelligence directly into power conversion hardware. According to Wise Integration, future generations of its WiseGan® platform will move functions such as protection, timing management, dead-time optimization and zero-voltage switching control closer to the power switch itself.
This distributed control approach reflects a broader industry movement toward embedding more intelligence at the device level rather than relying solely on centralized controllers. Such architectures are increasingly viewed as important for applications requiring rapid response times and high efficiency, including AI servers, data centers and emerging high-voltage power systems.
The company also outlined plans for its next-generation WiseWare 2 platform, which it says will further expand digital control capabilities within power conversion systems. One area of development involves greater integration of power factor correction management and control functions to increase power density and system optimization.
Industry analysts note that demand for more efficient power conversion technologies is rising as AI data centers consume increasing amounts of electricity. Power efficiency has become a strategic consideration not only for reducing operating costs but also for addressing thermal management challenges in high-performance computing environments.
Wise Integration's roadmap reflects a wider shift within the power electronics sector toward software-defined power architectures, where digital control plays a larger role in determining system performance. As AI infrastructure, electrification, aerospace systems and advanced industrial applications continue to expand, competition is increasingly focused on how effectively semiconductor technologies, control software and system design can be integrated.
Founded in 2020 and headquartered in France, Wise Integration develops GaN-based power semiconductor technologies and digital control solutions for applications including consumer electronics, electric mobility, industrial systems, automotive electronics and AI infrastructure.
