LG Innotek is stepping up efforts to strengthen its semiconductor substrate business by unveiling next-generation technologies designed for the rapidly growing artificial intelligence market.
The company will showcase its latest semiconductor substrate solutions at KPCA Show 2026, which runs from Sept. 9 to 11 at Songdo Convensia in Incheon, including a large-scale flip-chip ball grid array (FC-BGA) developed for AI accelerators.
The AI accelerator FC-BGA is the centerpiece of LG Innotek’s exhibition. The high-end substrate connects semiconductor chips with main boards and is used in high-performance processors such as graphics processing units (GPUs) and neural processing units (NPUs).
Unlike conventional FC-BGAs, substrates for AI accelerators must accommodate significantly more circuits and components to support high-speed data processing. This requires advanced technologies for high-density circuitry and large-area substrate manufacturing.
LG Innotek’s newly unveiled AI accelerator FC-BGA measures more than 100 millimeters on each side. The product incorporates the company’s accumulated expertise in ultra-fine circuit formation and multilayer substrate manufacturing developed over more than five decades.
The company plans to begin mass production of high-value FC-BGAs for AI training and inference applications in 2027. It will also display an 85-millimeter FC-BGA and a sample of an ultra-large substrate with approximately 40% more surface area.
LG Innotek is also presenting chip-embedding technology, which places semiconductor chips inside the substrate rather than mounting them on its surface. By shortening the electrical connection between the chip and substrate, the technology can improve signal transmission while reducing electrical resistance and power losses.
Another key technology on display is glass substrate technology. By replacing the core layer of a semiconductor substrate with glass, the technology can reduce warpage and circuit distortion while supporting the demands of increasingly sophisticated semiconductor packaging. LG Innotek aims to begin mass production of glass substrates in 2028.
The company will also showcase a range of package substrates, including its RF-SiP (Radio Frequency-System in Package) substrates and FC-CSP (Flip Chip-Chip Scale Package) products. Demand for high-performance memory-related substrates is expected to expand as AI inference applications become more widespread.
Its Cu-Post technology is another highlight. The process uses ultra-fine copper posts topped with solder balls to connect semiconductor substrates to main boards. By reducing the spacing between solder balls to roughly 20% of conventional levels, the technology enables greater circuit density. Copper’s thermal conductivity, which is more than seven times higher than that of lead, also helps improve heat dissipation.
In the tape substrate segment, LG Innotek will introduce display-oriented COF and 2-Metal COF products as well as ECONOVA, a next-generation smart IC substrate. ECONOVA uses an eco-friendly material that can deliver high performance without relying on precious-metal plating processes involving palladium or gold, making it particularly relevant to markets facing tighter environmental regulations.
LG Innotek’s push into advanced substrates comes as its package solutions business continues to improve both sales and profitability.
The business generated 935.6 billion won in revenue and 99.6 billion won in operating profit in the first half of 2026, representing year-on-year increases of 18% and 94%, respectively. Its operating margin also improved to 10.6% from 6.5% a year earlier.
LG Innotek is positioning package solutions as a core future growth engine and aims to expand the business to approximately 1 trillion won in annual operating profit by 2031.
“Visitors will be able to see how LG Innotek’s substrates are being applied across industries ranging from AI and smartphones to mobility,” said George Tae Cho, executive vice president and head of the company’s Package Solutions Business Division. “We will continue to reshape the substrate market with innovative products and technologies.”
