Microchip Technology on Feb. 4 launched the “MCPF1525” power module, a highly integrated power solution featuring an onboard 16V input voltage (Vin) buck converter. / Image courtesy of Microchip Technology.
As AI and high-performance computing (HPC) workloads expand, demand is rising for data-center power designs that can secure efficiency, reliability, and scalability at the same time. Against this backdrop, Microchip Technology said on Feb. 4 that it has launched the “MCPF1525” power module, a highly integrated power solution featuring an onboard 16V input-voltage (Vin) buck converter. The company said the module provides 25A of DC-DC current per module and is designed to scale up to 200A through a stackable configuration.
Microchip said the MCPF1525 is designed to enable higher power-delivery density within the same rack footprint. It added that the module integrates a programmable PMBus™ interface and I2C control to support power configuration and monitoring, and is engineered to power the latest-generation PCIe® switches and high-performance computing MPU applications used in AI deployments.
The company also highlighted the module’s form factor and packaging. According to Microchip, the MCPF1525 adopts a vertical packaging architecture to maximize board-area efficiency, reducing board footprint by up to 40% compared with alternative solutions. The module measures approximately 6.8 mm × 7.65 mm × 3.82 mm, which the company said is aimed at space-constrained AI server designs.
On reliability, Microchip emphasized diagnostic and protection features. The company said the MCPF1525 includes a range of telemetry and diagnostics reported via PMBus™, and incorporates over-temperature, over-current, and over-voltage protection to reduce the risk of undetected faults. The device is specified to operate over a junction temperature range of -40°C to +125°C. Microchip added that an on-board embedded EEPROM allows users to program default power settings (power-up configuration).
Rudy Jaramillo, vice president of Microchip’s Analog Power and Interface business unit, said that by leveraging Microchip’s broader portfolio—including PCIe® Switchtec™ technology, FPGAs, MPUs, and Flashtec® NVMe® controllers—the MCPF1525 power module can help customers achieve the system efficiency, reliability, and scalability required for high-performance data centers and industrial computing applications. He added that integration across the portfolio can simplify development, reduce risk, and help designers shorten time to market.
Microchip said the MCPF1525 integrates a custom inductor designed to reduce conducted and radiated noise. The company added that this design can help improve signal integrity, data accuracy, and overall reliability in high-speed computing, while reducing repetitive data retransmissions that consume system power and processing time.
Alongside the launch, Microchip said it offers a broader lineup of DC-DC power modules supporting input voltages from 5.5V to 70V. The company said these modules are delivered in ultra-compact, ruggedized, thermally enhanced packages designed to support high power density, and added that further details are available on its website.
