LG Chem is stepping up efforts to expand its presence in the semiconductor materials market by participating in SEMICON Taiwan 2026, one of Asia’s largest semiconductor industry exhibitions.
LG Chem said Aug. 26 that it will showcase a broad portfolio of materials for artificial intelligence (AI) semiconductors, high-bandwidth memory (HBM) and advanced semiconductor packaging at the event, which will take place from Sept. 2 to 4 at the Taipei Nangang Exhibition Center in Taiwan.
SEMICON Taiwan brings together major semiconductor manufacturers, outsourced semiconductor assembly and test (OSAT) companies, substrate makers and packaging specialists. The event has emerged as a key platform for showcasing technologies aimed at next-generation AI chips and advanced packaging.
At its exhibition booth in TaiNEX 2, LG Chem will present materials designed to support the growing demand for AI semiconductors and high-performance computing (HPC). The lineup includes copper clad laminates, glass core solutions, build-up films and dry film solder resists, as well as photo-imageable dielectric materials, die attach films, bonding and debonding solutions and strippers for fine semiconductor processes.
The company will also highlight materials designed to improve the performance and reliability of power semiconductors used in AI data centers. These include conductive sintering pastes based on silver and copper, thermal interface materials and thermal management devices incorporating copper metal foam.
With AI computing driving higher chip performance and power consumption, controlling heat while maintaining electrical efficiency has become a critical challenge across the semiconductor industry. LG Chem is positioning its materials portfolio to address these demands by combining packaging technologies with solutions for power efficiency and thermal management.
The company plans to use the exhibition as an opportunity to engage with global semiconductor manufacturers, OSAT firms and substrate and packaging companies. Through technical discussions and potential joint projects, LG Chem aims to expand its customer base and identify new business opportunities in the rapidly growing AI semiconductor and advanced packaging markets.
“Customer demand for high-performance materials is increasing as the AI semiconductor and advanced packaging markets continue to expand,” LG Chem CEO Kim Dong-chun said. “We will strengthen cooperation with semiconductor customers based on our differentiated materials portfolio and actively pursue new growth opportunities in the future semiconductor market.”
LG Chem is also pursuing a broader expansion of its electronic materials business. The company aims to double the business, currently worth around 1 trillion won, by 2030.
To achieve this goal, LG Chem has identified semiconductors, automotive electronics and next-generation displays as its core electronic materials businesses. It has also reorganized and expanded its advanced research and development capabilities to accelerate the development of next-generation materials.
By strengthening its semiconductor packaging portfolio and focusing on higher-value electronic materials, LG Chem is seeking to establish a stronger foothold in markets benefiting from the rapid expansion of AI infrastructure and advanced computing.
