LG Electronics is stepping up its push into the rapidly growing AI data center infrastructure market after being officially added to NVIDIA’s partner ecosystem in the Power and Cooling category.
LG Electronics said it has been registered as a Power and Cooling partner in the NVIDIA Partner Network (NPN), a global program that connects companies providing technologies and solutions for AI infrastructure with NVIDIA customers.
The partnership gives LG Electronics an additional channel to engage with global AI data center operators and expand its liquid cooling business, including chillers that produce chilled water and coolant distribution units (CDUs) that circulate cooling water to remove heat generated by servers.
The company has been strengthening its technical capabilities in high-capacity CDUs as AI servers become increasingly power-dense. Its 600-kilowatt and 1-megawatt CDUs have met NVIDIA’s qualification requirements, while its latest 2.5MW CDU has also fulfilled the requirements for NVIDIA’s DSX Ready designation.
The 2.5MW-class CDU is designed to address the growing cooling requirements of high-density AI data centers. As AI accelerators become more powerful, the amount of heat generated by servers is increasing, making conventional air cooling increasingly difficult to apply to the most densely configured systems.
LG Electronics is therefore expanding beyond individual cooling products toward integrated thermal-management solutions. Its portfolio includes chillers, computer room air handlers, cold plates that directly absorb heat from server chips, and CDUs that circulate and distribute coolant.
The company describes this approach as a “chip-to-chiller” solution, linking cooling equipment from the server level to the broader data center cooling infrastructure.
Industry analysts say the rise of AI is changing data center cooling from a conventional facility-management function into a critical component of computing infrastructure. Higher rack power densities are accelerating the adoption of liquid cooling, while data center operators are increasingly looking for solutions that can manage both cooling efficiency and overall infrastructure performance.
NVIDIA has also been expanding its AI factory architecture to integrate computing, networking, power, cooling and software. Against this backdrop, LG Electronics’ inclusion in NVIDIA’s Power and Cooling partner ecosystem could provide an additional route for the Korean company to participate in global AI data center projects.
LG Electronics entered the data center cooling market in 2011 and has since expanded its portfolio from large air-cooled and water-cooled chillers to liquid cooling technologies. The company is particularly targeting North America, where investment in AI data center infrastructure is accelerating.
With CDU capacities now spanning 600kW, 1MW and 2.5MW, LG Electronics plans to address a wider range of cooling requirements while expanding its integrated thermal-management business.
Lee Jae-sung, president of LG Electronics’ Eco Solution Business Company, said the company’s inclusion in NVIDIA’s partner network demonstrates the competitiveness of its thermal-management technology for next-generation AI data center infrastructure and will help accelerate its expansion in the global cooling market.
